2- Bond strengths of auto cure buildup resins to dual cure adhesives with & without use of the adhesives dual cure component
(3B in APR 2003 CRA Newsletter)

 

Research Question: What effect does using the dual cure component of an adhesive system have on bond strengths to auto cure buildup resins?  All of the adhesives with dual cure components were tested with Ti Core and Core-Flo.  The three most popular adhesives that have made a change to a dual cure component were chosen for expanded testing (increased sample size for statistical analysis) with Core-Flo auto curing buildup resin.  Test time was 10 minutes after placement of core material.

Chart 1: 10 minute bond strengths (MPa) of 3 dual cure adhesives to Core-Flo (auto cure buildup) with and without use of the adhesive dual cure component.

Adhesives

Light cure

Dual cure

Prime & Bond NT

9.7

Optibond Solo Plus

8.1

Clearfil Liner Bond 2V

8.4

Mean bond

0.0

8.7

= statistically lower

 

Summary of chart: Bond strengths were statistically lower for each adhesive when it was used without its dual cure component. Other CRA data showed all adhesives, but one, had higher bond strengths when dual cure component was used.  Bond 1 had higher bond strengths, but they were still below 5 MPa.   These data indicate dual cure components of adhesive systems should be used with dual cure adhesives when bonding to auto cure buildup resins.

 

Previous Page

Main Additional Details Index